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PCB Assembly

PCB Assembly Uncontrolled Moisture Leads to Micro Corrosion


Printed Circuit Board which interconnect the conductors and circuit components on a electric board is widely used in almost all electronic devices. Ingress of moisture during PCB assembly can increase the number of failures during assembly, and decrease the circuit assemblies and its life.

Effects of Uncontrolled Moisture

Exposure to high moisture during Printed Circuit Board (PCB) assembly and manufacturing, leads to:

  • Microscopic corrosion
  • Adhesion failures
  • Surface defects
  • Decreased performance of the circuit board.
  • Increase electrical resistance
  • Decrease capacitance

Causes of Uncontrolled Moisture

The electronic compounds are mounted and interconnected to form a circuit. These compunds are hygroscopic and absorb moisture and make cuts in the bridging of microscopic circuit lines, resulting in circuit failures.

General Recommendations

Relative Humidity in PCB Assembly Clean Rooms should be maintained at 20%-35% RH at 20°C temperature.

Bry-Air Solution

Desiccant Dehumidifiers provide the ideal low humidity environment in the manufacturing, assembly and storage of these precision, high quality electronic Printed Circuit Boards since they are capable of maintaining RH as low as 1% or even lower at a constant level, regardless of ambient conditions.

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