APPLICATION: PCB Assembly
FFPs - Frequently Faced Problems
During Printed Circuit Board (PCB) Assembly manufacturing, exposure to high humidity/ moisture can lead to microscopic corrosion on the surface of the circuits. This causes adhesion failures, surface defects and decreased performance of the Circuit Board.

General Recommendation :
Relative Humidity in PCB Assembly Clean Rooms should be maintained at 20%-35% RH at 20ºC (70ºF).

Our Solution :
The Background
For 20 years, the information revolution has been built on the sand silicon based chip. Each year, by cramming more circuits on a memory or microprocessor chip, engineers have made computing technology cheaper, more plentiful and more adaptable to new uses. Smaller has always been better, yet never good enough. With the chip becoming the size of a thumbtack, the size of printed circuit boards, or PCBs, is also getting smaller.

The Process
The circuit board in it's simplest form is a piece of insulating material, such as epoxy or phenolic resins, on which chips (integrated circuits) and other electronic components are mounted and interconnected to form a circuit. Most modern circuit boards use patterns of copper foil to interconnect the components. The foil layers may be on one or both sides of the board and, in more advanced designs, in several layers within the board.
Photosensitive polymer compounds called photo-resistors are applied to the surface to selectively mask circuit lines for the etching process. The hygroscopic nature of these compounds can cause the adsorbed moisture to make cuts in the bridging of microscopic circuit lines, resulting in circuit failures. The relative humidity of air in the photolithography clean rooms where etching is done is therefore maintained at controlled levels. For best results clean rooms are generally maintained at 20% to 35% Relative Humidity at 20ºC.
Moisture control is also absolutely essential when quartz crystals are incorporated with the printed circuit boards. The quartz crystal boards, after assembly, are put through an aging process during which time the humidity level must be carefully controlled to prevent the crystal from absorbing water vapour.

The Problem

Exposure to high humidity can lead to corrosion on the surface of the circuits. This is known as microscopic corrosion. Even minute layers of corrosion can increase electrical resistance and decrease capacitance, affecting performance. Excessive moisture, therefore, causes adhesion failures, surface defects and decreased performance. In fact, the smaller and denser the microcircuit, the larger the problem in performance.

The Solution

Desiccant Dehumidifiers provide the ideal low humidity environment in the manufacture, assembly and storage of these precision, high quality electronic Printed Circuit Boards, since they are capable of maintaining RH as low as 1% or even lower at a constant level,regardless of ambient conditions.